Two-stage top source drain epitaxy formation for vertical field effect transistors enabling gate last formation

ABSTRACT

A semiconductor structure including a bottom source drain region arranged on a substrate, a semiconductor channel region extending vertically upwards from a top surface of the bottom source drain region, a metal gate disposed on and around the semiconductor channel region, and a top source drain region above the semiconductor channel region and comprising a first doped epitaxy region and a second doped epitaxy region.

BACKGROUND

The present invention generally relates to semiconductor manufacturing,and more particularly to vertical field effect transistors.

Vertical transistors are an attractive option for technology scaling for5 nm and beyond technologies. Vertical transistors have a channeloriented perpendicular to the substrate surface, as opposed to beingsituated along the plane of the surface of the substrate in the case ofa lateral transistor. By using a vertical design, it is possible toincrease packing density. That is, by having the channel perpendicularto the substrate, vertical transistors improve the scaling limit beyondlateral transistors.

SUMMARY

According to one embodiment of the present invention, a verticaltransistor device is provided. The vertical transistor device includes abottom source drain region arranged on a substrate, a semiconductorchannel region extending vertically upwards from a top surface of thebottom source drain region, a metal gate disposed on and around thesemiconductor channel region, and a top source drain region above thesemiconductor channel region and comprising a first doped epitaxy regionand a second doped epitaxy region.

According to one embodiment of the present invention, a verticaltransistor device is provided. The vertical transistor device includes abottom source drain region arranged on a substrate, a semiconductorchannel region extending vertically upwards from a top surface of thebottom source drain region, a metal gate disposed on and around thesemiconductor channel region, a top source drain region above thesemiconductor channel region and comprising a first epitaxy region and asecond epitaxy region, and a dielectric spacer disposed on the metalgate beneath the second epitaxy region, the dielectric spacer contactsvertical sidewalls of the metal gate and vertical sidewalls of the firstepitaxy region.

According to one embodiment of the present invention, a method offorming a vertical transistor device is provided. The method includesforming a bottom source drain region on a substrate, forming asemiconductor channel region extending vertically upwards from a topsurface of the bottom source drain region, forming a metal gate disposedon and around the semiconductor channel region; and forming a top sourcedrain region above the semiconductor channel region, the top sourcedrain region comprises a first epitaxy region and a second epitaxyregion.

BRIEF DESCRIPTION OF THE DRAWINGS

The following detailed description, given by way of example and notintended to limit the invention solely thereto, will best be appreciatedin conjunction with the accompanying drawings, in which:

FIG. 1 is a cross-sectional view of a semiconductor structure during anintermediate step of a method of fabricating a vertical transistor witha two-stage top source drain epitaxy according to an exemplaryembodiment;

FIG. 2 is a cross-sectional view of a semiconductor structure afterforming bottom spacers according to an exemplary embodiment;

FIG. 3 is a cross-sectional view of a semiconductor structure afterdepositing a first sacrificial dielectric layer according to anexemplary embodiment;

FIG. 4 is a cross-sectional view of a semiconductor structure afterdepositing a sacrificial gate layer according to an exemplaryembodiment;

FIG. 5 is a cross-sectional view of a semiconductor structure afterrecessing the sacrificial gate layer according to an exemplaryembodiment;

FIG. 6 is a cross-sectional view of a semiconductor structure afterdepositing a second sacrificial dielectric layer according to anexemplary embodiment;

FIG. 7 is a cross-sectional view of a semiconductor structure afterremoving masks from atop the semiconductor fins according to anexemplary embodiment;

FIG. 8 is a cross-sectional view of a semiconductor structure afterremoving top portions of the first sacrificial dielectric layeraccording to an exemplary embodiment;

FIG. 9 is a cross-sectional view of a semiconductor structure afterforming inner spacers according to an exemplary embodiment;

FIG. 10 is a cross-sectional view of a semiconductor structure afterforming first top epitaxy regions according to an exemplary embodiment;

FIG. 11 is a cross-sectional view of a semiconductor structure afterforming a dielectric cap according to an exemplary embodiment;

FIG. 12 is a cross-sectional view of a semiconductor structure afterremoving the second sacrificial dielectric layer according to anexemplary embodiment;

FIG. 13 is a cross-sectional view of a semiconductor structure afterremoving the sacrificial gate layer and the first sacrificial dielectriclayer according to an exemplary embodiment;

FIG. 14 is a cross-sectional view of a semiconductor structure afterforming a gate dielectric and a metal gate according to an exemplaryembodiment;

FIG. 15 is a cross-sectional view of a semiconductor structure afterrecessing the metal gate and forming top spacers according to anexemplary embodiment;

FIG. 16 is a cross-sectional view of a semiconductor structure aftertrimming the gate dielectric and the metal gate according to anexemplary embodiment;

FIG. 17 is a cross-sectional view of a semiconductor structure afterforming an interlevel dielectric layer according to an exemplaryembodiment;

FIG. 18 is a cross-sectional view of a semiconductor structure afterremoving the top spacers and the dielectric cap, and recessing the innerspacers according to an exemplary embodiment;

FIG. 19 is a cross-sectional view of a semiconductor structure afterrecessing the gate dielectric and the metal gate according to anexemplary embodiment;

FIG. 20 is a cross-sectional view of a semiconductor structure afterforming spacer extensions according to an exemplary embodiment;

FIG. 21 is a cross-sectional view of a semiconductor structure afterforming a protective sidewall liner according to an exemplaryembodiment;

FIG. 22 is a cross-sectional view of a semiconductor structure afterforming second top epitaxy regions according to an exemplary embodiment;

FIG. 23 is a cross-sectional view of a semiconductor structure afterforming contact structures according to an exemplary embodiment;

FIG. 24 is a cross-sectional view of a semiconductor structure accordingto an exemplary embodiment; and

FIG. 25 is a cross-sectional view of a semiconductor structure accordingto an exemplary embodiment.

The drawings are not necessarily to scale. The drawings are merelyschematic representations, not intended to portray specific parametersof the invention. For clarity and ease of illustration, scale ofelements may be exaggerated. The drawings are intended to depict onlytypical embodiments of the invention. In the drawings, like numberingrepresents like elements.

DETAILED DESCRIPTION

Detailed embodiments of the claimed structures and methods are disclosedherein; however, it can be understood that the disclosed embodiments aremerely illustrative of the claimed structures and methods that may beembodied in various forms. This invention may, however, be embodied inmany different forms and should not be construed as limited to theexemplary embodiments set forth herein. In the description, details ofwell-known features and techniques may be omitted to avoid unnecessarilyobscuring the presented embodiments.

References in the specification to “one embodiment”, “an embodiment”,“an example embodiment”, etc., indicate that the embodiment describedmay include a particular feature, structure, or characteristic, butevery embodiment may not necessarily include the particular feature,structure, or characteristic. Moreover, such phrases are not necessarilyreferring to the same embodiment. Further, when a particular feature,structure, or characteristic is described in connection with anembodiment, it is submitted that it is within the knowledge of oneskilled in the art to affect such feature, structure, or characteristicin connection with other embodiments whether or not explicitlydescribed.

For purposes of the description hereinafter, the terms “upper”, “lower”,“right”, “left”, “vertical”, “horizontal”, “top”, “bottom”, andderivatives thereof shall relate to the disclosed structures andmethods, as oriented in the drawing figures. It will be understood thatwhen an element as a layer, region or substrate is referred to as being“on” or “over” another element, it can be directly on the other elementor intervening elements may also be present. In contrast, when anelement is referred to as being “directly on” or “directly over” anotherelement, there are no intervening elements present. It will also beunderstood that when an element is referred to as being “connected” or“coupled” to another element, it can be directly connected or coupled tothe other element or intervening elements may be present. In contrast,when an element is referred to as being “directly connected” or“directly coupled” to another element, there are no intervening elementspresent. Also, the term “sub-lithographic” may refer to a dimension orsize less than current dimensions achievable by photolithographicprocesses, and the term “lithographic” may refer to a dimension or sizeequal to or greater than current dimensions achievable byphotolithographic processes. The sub-lithographic and lithographicdimensions may be determined by a person of ordinary skill in the art atthe time the application is filed.

The terms substantially, substantially similar, about, or any other termdenoting functionally equivalent similarities refer to instances inwhich the difference in length, height, or orientation convey nopractical difference between the definite recitation (e.g. the phrasesans the substantially similar term), and the substantially similarvariations. In one embodiment, substantial (and its derivatives) denotea difference by a generally accepted engineering or manufacturingtolerance for similar devices, up to, for example, 10% deviation invalue or 10° deviation in angle.

In the interest of not obscuring the presentation of embodiments of thepresent invention, in the following detailed description, someprocessing steps or operations that are known in the art may have beencombined together for presentation and for illustration purposes and insome instances may have not been described in detail. In otherinstances, some processing steps or operations that are known in the artmay not be described at all. It should be understood that the followingdescription is rather focused on the distinctive features or elements ofvarious embodiments of the present invention.

The present invention generally relates to semiconductor manufacturing,and more particularly to vertical field effect transistors. One way tomanufacture a vertical field effect transistor may include manufacturinga top source drain region in two stages. One embodiment by which tomanufacture the two-stage top source drain region is described in detailbelow by referring to the accompanying drawings in FIGS. 1 to 26. Thoseskilled in the art will readily appreciate that the detailed descriptiongiven herein with respect to these figures is for explanatory purposesas the invention extends beyond these limited embodiments.

Referring now to FIG. 1, a structure 100 is shown during an intermediatestep of a method of fabricating a vertical transistor with a two-stagetop source drain epitaxy according to an embodiment of the invention.The structure 100 illustrated in FIG. 1 includes a semiconductorsubstrate 102 (hereinafter “substrate”) having bottom source drainregions 104, semiconductor fins 108, and shallow trench isolationregions 112 (hereinafter “STI regions”) formed thereon.

The substrate 102 is shown and may be formed from any appropriatematerial including, e.g., bulk semiconductor or asemiconductor-on-insulator layered structure. Illustrative examples ofsuitable materials for the substrate 102 include, but are not limitedto, silicon, silicon germanium, carbon dope silicon germanium, carbondoped silicon, polysilicon, epitaxial silicon, amorphous silicon, andmulti-layers thereof. Although silicon is the predominantly usedsemiconductor material in wafer fabrication, alternative semiconductormaterials can be employed, such as, but not limited to, galliumarsenide, indium phosphide, indium gallium arsenide, indium arsenide,gallium, cadmium telluride and zinc sellenide.

In the present embodiment, the substrate 102 is a bulk semiconductorsubstrate. By “bulk” it is meant that the semiconductor substrate 102 isentirely composed of at least one of the above materials listed above.In an embodiment, the substrate 102 can be entirely composed of silicon.In other embodiments, the semiconductor substrate 102 may include amultilayered semiconductor material stack including at least twodifferent semiconductor materials, as defined above. In an embodiment,the multilayered semiconductor material stack may include, in any order,a stack of silicon and a silicon germanium alloy. In another embodiment,the semiconductor substrate 102 may include a single crystallinesemiconductor material. Such single crystal materials may have any ofthe well-known crystal orientations. For example, the crystalorientation of the semiconductor substrate 102 may be {100}, {110}, or{111}. Other crystallographic orientations besides those specificallymentioned can also be used in the present application.

The bottom source drain regions 104 are epitaxially grown withintrenches formed in the substrate 102. It should be understood that thebottom source drain regions 104 may be either one of a source region ora drain region, as appropriate. Illustrative examples of suitablematerials for the bottom source drain regions 104 include, but are notlimited to, silicon, silicon germanium, silicon germanium carbide,silicon carbide, polysilicon, epitaxial silicon, amorphous silicon, andmulti-layers thereof. Although silicon is the predominantly usedsemiconductor material in wafer fabrication, alternative semiconductormaterials can be employed, such as, but not limited to, germanium,gallium arsenide, gallium nitride, silicon germanium, cadmium tellurideand zinc sellenide.

The bottom source drain regions 104 may be doped with dopant atoms. Thebottom source drain regions 104 may be in-situ doped as it is depositedon the substrate 102 or, alternatively, may be doped through animplantation technique. The dopant atoms may be an n-type dopant or ap-type dopant. Exemplary n-type dopants include phosphorus, arsenicantimony, selenium, tellurium, silicon, and germanium. Exemplary p-typedopants include beryllium, zinc, cadmium, silicon, germanium, boron,aluminum, and gallium. In an embodiment, the bottom source drain regions104 are made from doped Si:C(P) (for n-type devices) or SiGe:B (forp-type devices), with dopant concentrations ranging from approximately2×10²⁰ to approximately 2.5×10²¹ atoms/cm2, with a dopant concentrationranging from approximately 4×10²⁰ to approximately 2×10²¹ atoms/cm2being more typical.

In another embodiment, the bottom source drain regions 104 may be formedfrom a III-V semiconductor. The term “III-V compound semiconductor”denotes a semiconductor material that includes at least one element fromGroup III of the Periodic Table of Elements and at least one elementfrom Group V of the Periodic Table of Elements. Typically, the III-Vcompound semiconductors are binary, ternary or quaternary alloysincluding III/V elements. Examples of III-V compound semiconductors thatcan be used in the present embodiments include, but are not limited toalloys of gallium arsenide, indium arsenide, indium antimonide, indiumphosphide, aluminum arsenide, indium gallium arsenide, indium aluminumarsenide, indium aluminum arsenide antimonde, indium aluminum arsenidephosphorude, indium gallium arsenide phosphorude and combinationsthereof. In an embodiment, the bottom source drain regions 104 are madefrom doped III-V semiconductor materials with dopant concentrationsranging from approximately 1×10¹⁸ to approximately 1×10²⁰ atoms/cm2,with a dopant concentration ranging from approximately 5×10¹⁸ toapproximately 8×10¹⁹ atoms/cm2 being more typical.

The semiconductor fins 108 are formed from a semiconductor layer (notshown), and form the channel of the vertical transistor device depictedby the structure 100. First, masks 110 are deposited on thesemiconductor layer. The masks 110 define regions for the semiconductorfins 108. The semiconductor layer is etched or patterned using ananisotropic etch such as, for example, reactive ion etching, to removematerial that is not covered by the masks 110 to form semiconductor fins108. Although the present application describes and illustrates theformation of two semiconductor fins 108 that are capped with the mask110, the present application can be employed when a single hard maskcapped semiconductor fin structure is formed, or when more than two hardmask capped semiconductor fin structures are formed.

As used herein, a “semiconductor fin” refers to a semiconductor materialthat includes a pair of vertical sidewalls that are parallel to eachother. As used herein, a surface is “vertical” if there exists avertical plane from which the surface does not deviate by more thanthree times the root mean square roughness of the surface. In anembodiment, each semiconductor fin 108 has a height ranging fromapproximately 20 nm to approximately 200 nm, and a width ranging fromapproximately 5 nm to approximately 30 nm. Other heights and/or widthsthat are lesser than, or greater than, the ranges mentioned herein canalso be used in the present application. Each semiconductor fin 108 isspaced apart from its nearest neighboring semiconductor fin 108 by apitch ranging from approximately 20 nm to approximately 100 nm; thepitch is measured from one point of one semiconductor fin to the exactpoint on a neighboring semiconductor fin. Also, each semiconductor fin108 is oriented parallel to each other. Each semiconductor fin 108extends upward from a top surface of the bottom source drain regions104.

The STI regions 112 are penetrate the bottom source drain regions 104and extend partially into the substrate 102. First, trenches are formedby any appropriate technique, for example an anisotropic etch ormachining. Next, the trenches are filled with a dielectric material toform the STI regions 112. The STI regions 112 may be formed from anyappropriate dielectric including, for example, silicon oxide (SiO_(x))or silicon nitride (Si_(x)N_(y)).

Referring now to FIG. 2, the structure 100 is shown after forming bottomspacers 114 in accordance with an embodiment of the present invention.As is shown, the bottom spacers 114 contact sidewall surfaces of a lowerportion of the at least one semiconductor fin 108. The bottom spacers114 have a height, or thickness, that is less than a height of eachsemiconductor fin 108. Stated differently, topmost surfaces of thebottom spacers 114 are vertically offset and located beneath topmostsurfaces of each mask 110.

The bottom spacers 114 are deposited on a top surface of the bottomsource drain regions 104. It is specifically contemplated that thebottom spacers 114 are deposited in an anisotropic manner, withoutaccumulation on the sidewalls of the semiconductor fins 108. This may beaccomplished using, e.g., gas cluster ion beam (GCM) deposition, wherethe surface is bombarded by high-energy cluster ions. In alternativeembodiments, other deposition techniques may be used to form the bottomspacers 114 only on the horizontal surfaces.

Alternatively, the bottom spacers 114 can be formed by first depositinga blanket dielectric layer following by a recess etch to remove aportion of the blanket dielectric layer. The recess etch removes aportion of the blanket dielectric layer until the bottom spacers 114remains. In such cases, the chosen dielectric material is etchedselective to the masks 110 and the semiconductor fins 108. In anexample, when the blanket dielectric layer is silicon oxide (SiO_(x))and the masks 110 are silicon nitride (Si_(x)N_(y)), a hydrofluoric acidor a buffered oxide etchant (i.e., a mixture of ammonium fluoride andhydrofluoric acid) may be used during the recess etch technique.

Suitable spacer materials include, but are not limited to, oxides suchas silicon oxide (SiO_(x)), nitrides such as silicon nitride(Si_(x)N_(y)), and/or low-κ materials such as carbon-doped oxidematerials containing silicon (Si), carbon (C), oxygen (O), and hydrogen(H) (SiCOH) or siliconborocarbonitride (SiBCN). The term “low-κ” as usedherein refers to a material having a relative dielectric constant κwhich is lower than that of silicon dioxide.

In an embodiment, the bottom spacers 114 include any dielectric materialthat is different, in terms of composition and etch rate, than certainother subsequently formed dielectric materials (e.g. first sacrificialdielectric layer 116) described in detail below. For example, when thebottom spacers 114 are silicon nitride (Si_(x)N_(y)), subsequentlyformed oxides may be removed selective to the bottom spacers 114.

Referring now to FIG. 3, the structure 100 is shown after depositing afirst sacrificial dielectric layer 116 in accordance with an embodimentof the present invention. The first sacrificial dielectric layer 116 isa continuous layer that is formed on physically exposed surfaces of thestructure 100. Specifically, the first sacrificial dielectric layer 116is deposited on exposed surfaces of the semiconductor fins 108, themasks 110, and the bottom spacers 114.

In an embodiment, the first sacrificial dielectric layer 116 is aconformal layer. By “conformal” it is meant that a material layer has afirst thickness as measured from a bottom surface to a topmost surfacethat is the same as a second thickness as measured from an innersidewall surface to an outer sidewall surface. In another embodiment,the first sacrificial dielectric layer 116 may be a non-conformal layer.The first sacrificial dielectric layer 116 may be formed using adeposition technique including, for example, chemical vapor deposition(CVD), plasma enhanced chemical vapor deposition (PECVD), physical vapordeposition (PVD), atomic layer deposition (ALD), evaporation, spin-oncoating, or sputtering. In either embodiment, the first sacrificialdielectric layer 116 does not entirely fill in the opening that remainsbetween each neighboring semiconductor fin 108.

The first sacrificial dielectric layer 116 is composed of any dielectricmaterial that is different, in terms of composition and etch rate, thanthe dielectric materials of either the masks 110 or the bottom spacers114. In an example, both the bottom spacers 114 and the masks 110 aresilicon nitride (Si_(x)N_(y)), while the first sacrificial dielectriclayer 116 is silicon oxide (SiO_(x)). As such, the first sacrificialdielectric layer 116 can be removed or etched selective to the bottomspacers 114, the masks 110, or both.

Referring now to FIG. 4, the structure 100 is shown after depositing asacrificial gate layer 118 in accordance with an embodiment of thepresent invention. The sacrificial gate layer 118 is deposited on anexposed surface of the first sacrificial dielectric layer 116. Thesacrificial gate layer 118 includes any material having a different etchrate than at least the first sacrificial dielectric layer 116 such as,for example, amorphous polysilicon. The sacrificial gate layer 118 canbe formed using a deposition technique including, for example, chemicalvapor deposition (CVD), plasma enhanced chemical vapor deposition(PECVD), physical vapor deposition (PVD), atomic layer deposition (ALD),evaporation, spin-on coating, or sputtering.

After deposition, a planarization technique such as, for example,chemical mechanical planarization (CMP) and/or grinding is applied. Theplanarization technique removes excess material of the sacrificial gatelayer 118 that extends above the masks 110, while leaving a portion ofthe sacrificial gate layer 118 in the space between and surrounding thesemiconductor fins 108. After polishing an upper surface of thesacrificial gate layer 118 is flush, or substantially flush, with anupper surface of the masks 110.

Referring now to FIG. 5, the structure 100 is shown after recessing thesacrificial gate layer 118 in accordance with an embodiment of thepresent invention. The recessing performed in this step of the presentapplication uses the vertical sidewall sacrificial dielectric layer 116and the masks 110 as an etch mask. The removal may be performed using atleast one anisotropic etching technique. After performing the etch,portions of the sacrificial gate layer 118 remain and upper portions ofthe sacrificial dielectric layer 116 are exposed.

Referring now to FIG. 6, the structure 100 is shown after depositing asecond sacrificial dielectric layer 120 in accordance with an embodimentof the present invention. The second sacrificial dielectric layer 120 isformed on a surface of the sacrificial gate layer 118. The secondsacrificial dielectric layer 120 is composed of any dielectric materialthat is different, in terms of composition and etch rate, than thedielectric materials of both the masks 110 and the first sacrificialdielectric layer 116. In an embodiment, and when the masks 110 arecomposed of silicon nitride (Si_(x)N_(y)). and the first sacrificialdielectric layer 116 composed of silicon nitride (Si_(x)N_(y)). thesecond sacrificial dielectric layer 120 is composed of a carbide suchas, for example, silicon carbide.

The second sacrificial dielectric layer 120 can be formed using adeposition technique including, for example, chemical vapor deposition(CVD), plasma enhanced chemical vapor deposition (PECVD), physical vapordeposition (PVD), atomic layer deposition (ALD), evaporation, spin-oncoating, or sputtering. In an embodiment, the thickness of the secondsacrificial dielectric layer 120 can range from approximately 50 nm toapproximately 500 nm. Other thicknesses that are lesser than 50 nm andgreater than 500 nm can also be employed as the thickness of the secondsacrificial dielectric layer 120.

After deposition, a planarization technique such as, for example,chemical mechanical planarization (CMP) and/or grinding is applied. Theplanarization technique removes excess material of the secondsacrificial dielectric layer 120 and exposing topmost surfaces of themasks 110. After polishing an upper surface of the second sacrificialdielectric layer 120 is flush, or substantially flush, with an uppersurface of the masks 110.

Referring now to FIG. 7, the structure 100 is shown after removing themasks 110 from atop the semiconductor fins 108 in accordance with anembodiment of the present invention. In doing so, an opening 122 isformed that exposes a topmost surface of the semiconductor fins 108. Theremoval of the masks 110 may be performed using an etch selective to thesemiconductor fins 108, the first sacrificial dielectric layer 116, andthe second sacrificial dielectric layer 120. In an embodiment, when themasks 110 are composed of silicon nitride (Si_(x)N_(y)), a hot (around150° C. to 180° C.) phosphoric acid solution may be used to remove themasks 110 selective to the first sacrificial dielectric layer 116 andthe second sacrificial dielectric layer 120.

Referring now to FIG. 8, the structure 100 is shown after removing topportions of the first sacrificial dielectric layer 116 in accordancewith an embodiment of the present invention. More specifically, thefirst sacrificial dielectric layer 116 is recessed such that topportions of the semiconductor fins 108 are exposed. The firstsacrificial dielectric layer 116 is recessed or etched selective to thesemiconductor fins 108, the sacrificial gate layer 118, and the secondsacrificial dielectric layer 120. The first sacrificial dielectric layer116 is etched using an anisotropic etch such as, for example, reactiveion etching, to remove top portions and create a void, or space, betweenthe sacrificial gate layer 118 and the semiconductor fins 108.

After etching, upper surfaces of the first sacrificial dielectric layer116 will be below an upper surface of the semiconductor fins 108. It iscritical that the first sacrificial dielectric layer 116 is recessedbelow upper surface of the semiconductor fins 108 to ensure isolationbetween gate metal and the top source drain (See FIG. 25). If the firstsacrificial dielectric layer 116 is not recessed below the top surfaceof the semiconductor fins 108, a later formed gate metal will touch thesource drain epitaxy and create a short. As such, controlling the depthof the first sacrificial dielectric layer 116 below the tops of thesemiconductor fins 108 will allow for accurate top junction definition.

Referring now to FIG. 9, the structure 100 is shown after forming innerspacers 124 along exposed vertical sidewalls within the opening 122 inaccordance with an embodiment of the present invention. Morespecifically, the inner spacers 124 may be formed along the verticalsidewalls of the sacrificial gate layer 118, the second sacrificialdielectric layer 120, and the semiconductor fins 108 exposed within theopening 122. A lower portion of the inner spacers 124 will fill the voidbetween the sacrificial gate layer 118 and the semiconductor fins 108created by the previous removal of the top portions of the firstsacrificial dielectric layer 116.

The inner spacers 124 may be formed using a deposition techniquefollowed by a spacer etch (anisotropic etch). For example, techniquesfor depositing the inner spacers 124 include, for example, chemicalvapor deposition (CVD), plasma enhanced chemical vapor deposition(PECVD), physical vapor deposition (PVD), atomic layer deposition (ALD),evaporation, spin-on coating, or sputtering. For example, techniques foretching the inner spacers 124 include dry etching techniques, such as,for example, reactive ion etching, ion beam etching, plasma etching orlaser ablation.

The inner spacers 124 are composed of any dielectric material that isdifferent, in terms of composition and etch rate, than the dielectricmaterial of the second sacrificial dielectric layer 120. Suitabledielectric materials include, but are not limited to, oxides such assilicon oxide (SiO_(x)), nitrides such as silicon nitride (Si_(x)N_(y)),and/or low-κ materials such as SiCOH or SiBCN. In an example, both theinner spacers 124 and the bottom spacers 114 are silicon nitride(Si_(x)N_(y)), while first sacrificial dielectric layer 116 is an oxide,for example silicon oxide (SiO_(x)). As such, the first sacrificialdielectric layer 116 can be subsequently removed or etched selective tothe inner spacers 124 (FIG. 15).

Referring now to FIG. 10, the structure 100 is shown after forming firsttop epitaxy regions 126 in accordance with an embodiment of the presentinvention. The first top epitaxy 126 is formed directly on top of thesemiconductor fins 108 exposed at a bottom of the opening 122, asillustrated.

The first top epitaxy 126 can be epitaxially grown using conventionaltechniques. The first top epitaxy 126 may contain a dopant such asboron, phosphorus, or arsenic as desired. The dopant concentration inthe first top epitaxy 126 should be sufficient to create the desireddopant transfer to the semiconductor fins 108 under reasonable time andtemperature conditions. Preferably, the first top epitaxy 126 has adopant concentration of at least about 1×10²¹ atoms/cm³, more preferablyat least about 2×10²¹ atoms/cm³, most preferably about 3×10²¹-6×10²¹atoms/cm³. Additionally, the thickness of the first top epitaxy 126should also be sufficient to provide the necessary dopant concentrationin the semiconductor fin 108 taking into account the dopantconcentration in the first top epitaxy 126 and the desired dopantprofile in the semiconductor fin 108. In an embodiment, the thickness ofthe first top epitaxy 126 can range from approximately 5 nm toapproximately 20 nm in order to achieve the necessary dopantconcentration. Other thicknesses that are lesser than 5 nm and greaterthan 20 nm can also be employed as the thickness of the first topepitaxy 126.

Like the bottom source drain regions 104, doping for the first topepitaxy 126 can be performed in-situ, and the composition of the firsttop epitaxy 126 and the dopants can vary depending on the type ofvertical transistor being formed. By way of example only, for a p-FET,the first top epitaxy 126 can include boron-doped SiGe, whereas for ann-FET, the first top epitaxy 126 can include phosphorous-doped Si:C. Inthe present application, the first top epitaxy 126 will have arelatively low volume, but a relatively high dopant concentration.

Referring now to FIG. 11, the structure 100 is shown after forming adielectric cap 128 in accordance with an embodiment of the presentinvention. More specifically, the dielectric cap 128 may be formedwithin and substantially fill the opening 122. The dielectric cap 128can be formed using a deposition technique including, for example,chemical vapor deposition (CVD), plasma enhanced chemical vapordeposition (PECVD), physical vapor deposition (PVD), atomic layerdeposition (ALD), evaporation, spin-on coating, or sputtering.

The dielectric cap 128 is composed of any dielectric material that isdifferent, in terms of composition and etch rate, than the dielectricmaterials of the first sacrificial dielectric layer 116 and the secondsacrificial dielectric layer 120. Suitable dielectric materials include,but are not limited to, oxides such as silicon oxide (SiO_(x)), nitridessuch as silicon nitride (Si_(x)N_(y)), and/or low-κ materials such asSiCOH or SiBCN. In an example, both the inner spacers 124 and thedielectric cap 128 are silicon nitride (Si_(x)N_(y)), while firstsacrificial dielectric layer 116 is an oxide, for example silicon oxide(SiO_(x)). As such, the second sacrificial dielectric layer 120 and thefirst sacrificial dielectric layer 116 can be subsequently removed oretched selective to the dielectric cap 128 (FIG. 15).

After deposition, a planarization technique such as, for example,chemical mechanical planarization (CMP) and/or grinding is applied. Theplanarization technique removes excess material of the dielectric cap128 that extends above the inner spacers 124. After polishing an uppersurface of the dielectric cap 128 is flush, or substantially flush, withan upper surface of the inner spacers 124.

After the first top epitaxy 126 is grown and the opening 122 is filledwith the dielectric cap 128, an anneal is performed to diffuse thedopants from the first top epitaxy 126 into the semiconductor fin 108,or top of the channel, to form the junction. In an embodiment, theannealing technique may include subjecting the structure 100 to anelevated temperature, ranging from approximately 800° C. toapproximately 1250° C., for approximately 1 ms to approximately 500 ms.In another embodiment, a high-temperature rapid thermal anneal (RTA)technique may be used. Typically, high temperatures cannot be used atthis stage of fabrication due to risk of damaging a gate meal or workfunction metal; however, in the present case the gate metal or workfunction metal has not yet been fabricated thus allowing the use of ahigh temperature junction anneal.

Referring now to FIG. 12, the structure 100 is shown after removing thesecond sacrificial dielectric layer 120 in accordance with an embodimentof the present invention. The second sacrificial dielectric layer 120 isremoved selective to the dielectric cap 128, the inner spacers 124, andthe sacrificial gate layer 118. The removal of second sacrificialdielectric layer 120 may be performed using at least one wet etchingtechnique. When the first sacrificial dielectric layer 116 is composedof silicon oxide (SiO_(x)), a hydrofluoric acid or a buffered oxide etch(as defined above) can be used. After performing the etch, uppersurfaces of the bottom spacers 114 and vertical sidewalls of thesemiconductor fins 108 are exposed.

Referring now to FIG. 13, the structure 100 is shown after removing thesacrificial gate layer 118 and the first sacrificial dielectric layer116 in accordance with an embodiment of the present invention. First,remaining portions of the sacrificial gate layer 118 are removedselective to the dielectric cap 128, the inner spacers 124, and thefirst sacrificial dielectric layer 116. The removal of the sacrificialgate layer 118 may be performed using at least one anisotropic etchingtechnique. After performing the etch, upper surfaces of the firstsacrificial dielectric layer 116 are exposed.

Next, remaining portions of the first sacrificial dielectric layer 116are removed selective to the dielectric cap 128, the inner spacers 124,and the bottom spacer layer 114. The removal of first sacrificialdielectric layer 116 may be performed using at least one wet etchingtechnique. When the first sacrificial dielectric layer 116 is composedof silicon dioxide, a hydrofluoric acid or a buffered oxide etch (asdefined above) can be used. After performing the etch, upper surfaces ofthe bottom spacer layer 114 and vertical sidewalls of the semiconductorfins 108 are exposed.

Referring now to FIG. 14, the structure 100 is shown after forming agate dielectric 130 and a metal gate 132 in accordance with anembodiment of the present invention. In doing so, the gate dielectric130 is in direct physical contact with exposed sidewall surfaces of thesemiconductor fins 108, otherwise referred to as a channel.

The gate dielectric 130 is composed of a gate dielectric material. Thegate dielectric 130 can be an oxide, nitride, and/or oxynitride. In anexample, the gate dielectric 130 can be a high-k material having adielectric constant greater than silicon dioxide. Exemplary high-kdielectrics include, but are not limited to, HfO₂, ZrO₂, La₂O₃, Al₂O₃,TiO₂, SrTiO₃, LaAlO₃, Y₂O₃, HfO_(x)N_(y), ZrO_(x)N_(y), La₂O_(x)N_(y),Al₂O_(x)N_(y), TiO_(x)N_(y), SrTiO_(x)N_(y), LaAlO_(x)N_(y),Y₂O_(x)N_(y), SiON, SiN_(x), a silicate thereof, and an alloy thereof.Each value of x is independently from 0.5 to 3 and each value of y isindependently from 0 to 2. In some embodiments, a multilayered gatedielectric structure including different gate dielectric materials,e.g., silicon dioxide, and a high-k gate dielectric can be formed andused as the gate dielectric 130.

The gate dielectric 130 can be formed by any deposition techniqueincluding, for example, chemical vapor deposition (CVD), plasma enhancedchemical vapor deposition (PECVD), physical vapor deposition (PVD),sputtering, or atomic layer deposition. In some embodiments, the metalgate 132 is also a conformal layer, as descried and defined above. In anembodiment, the gate dielectric 130 can have a thickness in ranging fromapproximately 1 nm to approximately 10 nm. Other thicknesses that arelesser than, or greater than, the aforementioned thickness range canalso be employed for the gate dielectric 130.

In an embodiment, the metal gate 132 is composed of an n-type workfunction metal. As used herein, an “n-type work function metal” is ametal that effectuates an n-type threshold voltage shift. “N-typethreshold voltage shift” as used herein means a shift in the Fermienergy of an n-type semiconductor device towards a conduction band ofsilicon in a silicon-containing substrate of the n-type semiconductordevice. The “conduction band” is the lowest lying electron energy bandof the doped material that is not completely filled with electrons. Inan embodiment, the work function of the n-type work function metalranges from 4.1 eV to 4.3 eV. In an embodiment, the n-type work functionmetal is composed of at least one of TiAl, TaN, TiN, HfN, HfSi, orcombinations thereof. The n-type work function metal can be formed usingchemical vapor deposition atomic layer deposition, sputtering orplating.

In another embodiment, the metal gate 132 may be a p-type work functionmetal. As used herein, a “p-type work function metal” is a metal thateffectuates a p-type threshold voltage shift. In an embodiment, the workfunction of the p-type work function metal ranges from 4.9 eV to 5.2 eV.As used herein, “threshold voltage” is the lowest attainable gatevoltage that will turn on a semiconductor device, for example,transistor, by making the channel of the device conductive. The term“p-type threshold voltage shift” as used herein means a shift in theFermi energy of a p-type semiconductor device towards a valence band ofsilicon in the silicon containing substrate of the p-type semiconductordevice. A “valence band” is the highest range of electron energies whereelectrons are normally present at absolute zero. In an embodiment, thep-type work function metal may be composed of titanium, titanium nitrideor titanium carbide. The p-type work function metal may also be composedof TiAlN, Ru, Pt, Mo, Co and alloys and combinations thereof. In anembodiment, the p-type work function metal can be formed by, a physicalvapor deposition method, such as sputtering, chemical vapor depositionor atomic layer deposition.

The metal gate 132 can be formed by any deposition technique including,for example, chemical vapor deposition (CVD), plasma enhanced chemicalvapor deposition (PECVD), physical vapor deposition (PVD), sputtering,or atomic layer deposition. Like the gate dielectric 130, in someembodiments, the metal gate 132 is also a conformal layer. In anembodiment, the metal gate 132 can have a thickness in a ranging fromapproximately 1 nm to approximately 10 nm. Other thicknesses that arelesser than, or greater than, the aforementioned thickness range canalso be employed for the used in providing the metal gate 132. It iscritical to monitor and control forming of the metal gate 132 to preventpinch off between adjacent devices.

Referring now to FIG. 15, the structure 100 is shown after recessing themetal gate 132 and forming top spacers 134 along exposed verticalsurfaces of the inner spacers 124 in accordance with an embodiment ofthe present invention. First, a planarization layer (not shown) isblanket deposited on the structure 100. The planarization layer can bean organic planarization layer (OPL) or a layer of material that iscapable of being planarized or etched by known techniques. In anembodiment, for example, the planarization layer can be an amorphouscarbon layer able to withstand the high temperatures of subsequentprocessing steps. The planarization layer can preferably have athickness sufficient to cover existing structures. For example, theplanarization layer would typically be deposited such that is covers themetal gate 132. After deposition of the OPL, a dry etching technique isapplied to recess the OPL and expose an uppermost surface of the metalgate 132.

Next, the metal gate 132 and the gate dielectric 130 are etchedselective to the inner spacers 124 and the dielectric cap 128. Morespecifically, the metal gate 132 and the gate dielectric 130 arerecessed below top surfaces of the inner spacers 124 and the dielectriccap 128. Recessing of the metal gate 132 and the gate dielectric 130 maybe performed using at least one wet etching technique.

Finally, the top spacers 134 may be formed along the exposed verticalsidewalls of the inner spacers 124. The top spacers 134 may be formedusing a deposition technique followed by a spacer etch (anisotropicetch). For example, techniques for depositing the top spacers 134include, for example, chemical vapor deposition (CVD), plasma enhancedchemical vapor deposition (PECVD), physical vapor deposition (PVD),atomic layer deposition (ALD), evaporation, spin-on coating, orsputtering. For example, techniques for etching the top spacers 134include dry etching techniques, such as, for example, reactive ionetching, ion beam etching, plasma etching or laser ablation.

The top spacers 134 are composed of any dielectric material that issimilar, in terms of composition and etch rate, to the dielectricmaterials of the inner spacers 124 and the dielectric cap 128. Likeabove, suitable dielectric materials include, but are not limited to,oxides such as silicon oxide (SiO_(x)), nitrides such as silicon nitride(Si_(x)N_(y)), and/or low-κ materials such as SiCOH or SiBCN. In anexample, the top spacers 134, the inner spacers 124 and the bottomspacers 114 are silicon nitride. As such, the metal gate 132 can besubsequently removed or etched selective to the top spacers 134, theinner spacers 124 and the bottom spacers 114 (FIG. 18). Finally, anyplanarization layer, for example the OPL, is removed by ashing.

Referring now to FIG. 16, the structure 100 is shown after self-alignedetching of the gate dielectric 130 and the metal gate 132 in accordancewith an embodiment of the present invention. The gate dielectric 130,and the metal gate 132 are etched selective to the top spacers 134, theinner spacers 124, the dielectric cap 128, and the bottom spacer 114.The etching performed in this step of the present application uses thetop spacers 134, the inner spacers 124 and the dielectric cap 128 as anetch mask, and stops on the bottom spacer 114. The etching may beperformed using any etching technique suitable for etching the materialsof the gate dielectric 130 and the metal gate 132. For example, etchingthe gate dielectric 130 and the metal gate 132 may include using ananisotropic dry etching technique (such as, for example, reactive ionetching, ion beam etching, plasma etching or laser ablation). Afteretching, the uppermost surface of the bottom spacer 114 is exposed.

Referring now to FIG. 17, the structure 100 is shown after forming aninterlevel dielectric layer 136 in accordance with an embodiment of thepresent invention. The interlevel dielectric layer 136 surrounds thestructure shown in FIG. 18 and has a topmost surface that is flush, orsubstantially flush, with each of the top spacers 134, the inner spacers124, and the dielectric cap 128. The interlevel dielectric layer 136 iscomposed of any dielectric material that is different, in terms ofcomposition and etch rate, than the dielectric materials of either thetop spacers 134, the inner spacers 124, and the dielectric cap 128.

The interlevel dielectric layer 136 may be composed of, for example,silicon oxide (SiO_(x)), undoped silicate glass (USG), fluorosilicateglass (FSG), borophosphosilicate glass (BPSG), a spin-on low-κdielectric layer, a chemical vapor deposition (CVD) low-κ dielectriclayer or any combination thereof. As indicated above, the term “low-κ”as used herein refers to a material having a relative dielectricconstant κ which is lower than that of silicon dioxide. In anotherexample, the interlevel dielectric layer 136 is silicon nitride(Si_(x)N_(y)), while the top spacers 134, the inner spacers 124, and thedielectric cap 128 are silicon oxide (SiO_(x)). In all cases, materialsshould be selected such that the top spacers 134, the inner spacers 124,and the dielectric cap 128 can be subsequently removed or etchedselective to the interlevel dielectric layer 136. In yet anotherexample, the interlevel dielectric layer 136 can be other dielectricssuch as SiC or SiCO. In another example, the interlevel dielectric layer136 can be a combination of several layers, such as a very thin layer ofsilicon nitride (Si_(x)N_(y)) followed by oxide overfill and CMP.

In an embodiment, the interlevel dielectric layer 136 can be formedusing a deposition technique including, for example, chemical vapordeposition (CVD), plasma enhanced chemical vapor deposition (PECVD),physical vapor deposition (PVD), atomic layer deposition (ALD),evaporation, spin-on coating, or sputtering. After deposition, aplanarization technique such as, for example, chemical mechanicalplanarization (CMP) and/or grinding is applied. The planarizationtechnique removes excess material of the interlevel dielectric layer 136and continues polishing until the uppermost surfaces of the top spacers134, the inner spacers 124, and the dielectric cap 128 are exposed.After polishing the uppermost surfaces of the top spacers 134, the innerspacers 124, and the dielectric cap 128 are flush, or substantiallyflush, with an uppermost surface of the interlevel dielectric layer 136.In another embodiment, interlevel dielectric layer 136 may include aself-planarizing material such as a spin-on glass (SOG) or a spin-onlow-κ dielectric material such as SiLK™. Doing so may avoid the need toperform a subsequent planarizing step.

Referring now to FIG. 18, the structure 100 is shown after removing thetop spacers 134 and the dielectric cap 128, and recessing the innerspacers 124 in accordance with an embodiment of the present invention.More specifically, the top spacers 134 and the dielectric cap 128 areremoved completely, and the inner spacers 124 are recessed such that topportions of the first top epitaxy 126 are exposed in an opening 138. Thetop spacers 134, the dielectric cap 128, and the inner spacers 124 arerecessed or etched selective to the interlevel dielectric layer 136, thegate dielectric 130, the metal gate 132, and the first top epitaxy 126.

The etching may be performed using any etching technique suitable foretching the materials of the top spacers 134, the dielectric cap 128,and the inner spacers 124 selective to the interlevel dielectric layer136, the gate dielectric 130, the metal gate 132, and the first topepitaxy 126. For example, etching the top spacers 134, the dielectriccap 128, and the inner spacers 124 may include using a dry etchingtechnique (such as, for example, reactive ion etching, ion beam etching,plasma etching or laser ablation), and/or a wet chemical etchingtechnique.

Referring now to FIG. 19, the structure 100 is shown after recessing thegate dielectric 130 and the metal gate 132 in accordance with anembodiment of the present invention. The gate dielectric 130, and themetal gate 132 are etched selective to the interlevel dielectric layer136 and remaining portions of the inner spacers 124. The etchingperformed in this step of the present application uses the interleveldielectric layer 136 and remaining portions of the inner spacers 124 asan etch mask. Etching continues until uppermost surfaces of both thegate dielectric 130 and the metal gate 132 are recessed to a level abovelowermost surfaces of the inner spacers 124, but below uppermostsurfaces of the inner spacers 124. It is critical that the gatedielectric 130 and the metal gate 132 are not recessed below a bottom ofthe inner spacers 124, or else there is a risk of creating a shortbetween the metal gate 132 and a subsequently formed top source drainregion—which includes the first top epitaxy 126.

The etching may be performed using any etching technique suitable foretching the materials of the gate dielectric 130 and the metal gate 132selective to the interlevel dielectric layer 136 and remaining portionsof the inner spacers 124. For example, etching the gate dielectric 130and the metal gate 132 may include using a dry etching technique (suchas, for example, reactive ion etching, ion beam etching, plasma etchingor laser ablation), and/or a wet chemical etching technique. As such,the gate dielectric 130 and the metal gate 132 have a signature notch orrecess occupied by the remaining portions of the inner spacers 124.

Referring now to FIG. 20, the structure 100 is shown after formingspacer extensions 140 in accordance with an embodiment of the presentinvention. The spacer extensions 140 are formed directly on the exposeduppermost surfaces of the gate dielectric 130 and the metal gate 132 andfill a space between the interlevel dielectric layer 136 and the innerspacers 124. Together, the inner spacers 124 and the spacer extensions140, which may be collectively referred to as a dielectric spacer,electrically isolate the metal gate 132 from a subsequently formed topsource drain region—which includes the first top epitaxy 126. The innerspacers 124 and the spacer extensions 140, together as the dielectricspacer, extend laterally from the semiconductor fins 108 and the firstepitaxy region 126 to the interlevel dielectric layer 136

The spacer extensions 140 are composed of any dielectric materialsimilar, in terms of composition and insulating properties, to thedielectric materials of the inner spacers 124. In an embodiment, andwhen the inner spacers 124 are composed of silicon oxide (SiO_(x)), thespacer extensions 140 are composed of a carbon compound such as, forexample, silicon carbon compound. In another embodiment, and when theinner spacers 124 are composed of silicon oxide (SiO_(x)), the spacerextensions 140 are also composed of silicon oxide (SiO_(x)).

The spacer extensions 140 can be formed using a deposition techniquefollowed by a recess etch. For example, techniques for depositing thespacer extensions 140 include, for example, chemical vapor deposition(CVD), plasma enhanced chemical vapor deposition (PECVD), physical vapordeposition (PVD), atomic layer deposition (ALD), evaporation, spin-oncoating, or sputtering. For example, techniques for recessing (etching)the spacer extensions 140 include dry etching techniques, such as, forexample, reactive ion etching, ion beam etching, plasma etching or laserablation. In an embodiment, uppermost surfaces of the spacer extensions140 may be flush, or substantially flush, with uppermost surfaces of theinner spacers 124. It should be noted that the overall height of thespacer extensions 140 may differ from the overall height of the innerspacers 124 as illustrated. The overall height of the spacer extensions140 is controlled by recessing the gate dielectric 130 and the metalgate 132 (see FIG. 21). In at least one emebodiment, the

Referring now to FIG. 21, the structure 100 is shown after forming aprotective sidewall liner 142 in accordance with an embodiment of thepresent invention. More specifically, the protective sidewall liner 142may be formed along the vertical sidewalls of the interlevel dielectriclayer 136 within the opening 138.

The protective sidewall liner 142 may be formed using a depositiontechnique followed by a spacer etch (anisotropic etch). For example,techniques for depositing the protective sidewall liner 142 include, forexample, chemical vapor deposition (CVD), plasma enhanced chemical vapordeposition (PECVD), physical vapor deposition (PVD), atomic layerdeposition (ALD), evaporation, spin-on coating, or sputtering. Forexample, techniques for etching the protective sidewall liner 142include dry etching techniques, such as, for example, reactive ionetching, ion beam etching, plasma etching or laser ablation.

The protective sidewall liner 142 is composed of any material havingsufficient properties to protect a subsequently formed top source drainregion—which includes the first top epitaxy 126, from electromigrationfailures caused by conductive material of the top source drain frommigrating into the interlevel dielectric layer 138. Suitable materialsinclude, but are not limited to, tantalum nitride and tantalum (TaN/Ta),titanium, titanium nitride, cobalt, ruthenium, and manganese.

Referring now to FIG. 22, the structure 100 is shown after formingsecond top epitaxy regions 144 in accordance with an embodiment of thepresent invention. The second top epitaxy 144 is formed directly on topof the first top epitaxy 126, the inner spacers 124, and the spacerextensions 140 within the opening 138. As such, the protective sidewallliner 142 separates the second top epitaxy 144 from contacting theinterlevel dielectric layer 136.

The second top epitaxy 144 can be epitaxially grown using conventionaltechniques. Like the first top epitaxy 126 described above, the secondtop epitaxy 144 may contain a dopant such as boron, phosphorus, orarsenic as desired. The dopant concentration in the second top epitaxy144 should be sufficient to produce a epitaxial region having highelectrical conductivity. Preferably, the second top epitaxy 144 has adopant concentration of at least about 4×10²⁰ atoms/cm³, more preferablyat least about 8×10²⁰ atoms/cm³, most preferably about 1×10²¹-2×10²¹atoms/cm³. Additionally, the thickness of the second top epitaxy 144should be sufficient to fill the opening 138.

Like the bottom source drain regions 104 and the first top epitaxy 126,doping for the second top epitaxy 144 can be performed in-situ, and thecomposition of the second top epitaxy 144 and the dopants can varydepending on the type of vertical transistor being formed. By way ofexample only, for a p-FET, the second top epitaxy 144 can includeboron-doped SiGe, whereas for an n-FET, the second top epitaxy 144 caninclude phosphorous-doped Si:C. In the present application the secondtop epitaxy 144 will have a relatively large volume, and a relativelyhigh dopant concentration. However, the dopant concentration of thesecond top epitaxy 144 will be less than the dopant concentration of thefirst top epitaxy 126.

After forming, unlike the first top epitaxy 126, the second top epitaxy144 does not undergo a high temperature anneal in order to preserve theintegrity of the metal gate 132. Additionally, the top junction waspreviously formed during forming and anneal of the first top epitaxy126.

Referring now to FIG. 23, the structure 100 is shown after formingcontact structures 146 in accordance with an embodiment of the presentinvention. First, more interlevel dielectric layer 136 is deposited ontop of the structure 100. Next, contact trenches are formed in theinterlevel dielectric layer 136. Finally, the contact trenches arefilled with a conductive material to form the contact structures 146.The contact structures 146 can be formed by deposition of a conductivematerial. The contact structures 146 may include any suitable conductivematerial, such as, for example, copper, aluminum, tungsten, cobalt, oralloys thereof. Examples of deposition techniques that can be used inproviding the spacer material include, for example, chemical vapordeposition (CVD), plasma enhanced chemical vapor deposition (PECVD), oratomic layer deposition (ALD). In some cases, an electroplatingtechnique can be used to form the contact structures 146.

After deposition, a planarization technique such as, for example,chemical mechanical planarization (CMP) and/or grinding is applied. Theplanarization technique removes excess conductive material of thecontact structures 146. After polishing an upper surface of the contactstructures 146 is flush, or substantially flush, with an upper surfaceof the additional interlevel dielectric layer 136.

As illustrated in FIG. 23, the vertical transistor device represented bythe structure 100 in this example has some distinctive notable features.For instance, the structure 100 includes a two-stage top source drainregion. More specifically, both the first top epitaxy 126 and the secondtop epitaxy 144 make-up the two-stage top source drain region. Thetwo-stage top source drain region is particularly beneficial because thefirst stage is fabricated using a high dopant concentration and a hightemperature anneal to maximize dopant diffusion at the top junction. Asdiscussed above, this is made possible because the metal gate 132 is notyet formed. The second stage, for example the second top epitaxy 144 isthen subsequently formed with larger dimensions suitable landing acontact. It may be noted that not all advantages of the presentinvention are included above.

Additionally, by forming the top source drain regions in two stages, weovercome the space issue and pinch off during gate last formation of thegate dielectric 130 and the metal gate 132. As discussed above withrespect to the formation of the first top epitaxy 126, the first stepincludes a very high doped, small volume epitaxy or even pure dopantdeposited onto the exposed fin end. Since the first top epitaxy 126 isformed prior to the gate metal 132, the junction anneal can be performedat any desired temperature. Doing so further allows fine tuning of thetop and bottom epitaxy dopant concentrations and expected diffusion,thereby making a symmetrical device in easier to form. After gate lastformation of the gate dielectric 130 and the metal gate 132 a second,lower doped, larger epitaxy is formed, as described in detail above withrespect to the second top epitaxy 144. This second top epitaxy processneeds to be low temperature, since the metal gate 136 is now in place.

Referring now to FIG. 24, in an alternative embodiment, the second topepitaxy 144 may be recessed after formation, thereby decreasing itsthickness.

Referring now to FIG. 25, in yet another embodiment, the second topepitaxy 144 can be grown such that the top of the second top epitaxy 144may have faceted surfaces allowing for increase contact area with asubsequently formed contact.

The descriptions of the various embodiments of the present inventionhave been presented for purposes of illustration, but are not intendedto be exhaustive or limited to the embodiments disclosed. Manymodifications and variations will be apparent to those of ordinary skillin the art without departing from the scope and spirit of the invention.The terminology used herein was chosen to best explain the principles ofthe embodiment, the practical application or technical improvement overtechnologies found in the marketplace, or to enable others of ordinaryskill in the art to understand the embodiments disclosed herein.

What is claimed is:
 1. A semiconductor structure comprising: a bottomsource drain region arranged on a substrate; a semiconductor channelregion extending vertically upwards from a top surface of the bottomsource drain region; a metal gate disposed on and around thesemiconductor channel region; and a top source drain region above thesemiconductor channel region and comprising a first doped epitaxy regionand a second doped epitaxy region.
 2. The semiconductor structureaccording to claim 1, further comprising: a bottom spacer separating thebottom source drain region from the metal gate.
 3. The semiconductorstructure according to claim 1, wherein a width of the first dopedepitaxy region of the top source drain region is substantially equal toa width of the semiconductor channel region, and wherein a width of thesecond doped epitaxy region of the top source drain region is largerthan the width of the semiconductor channel region.
 4. The semiconductorstructure according to claim 1, further comprising: sidewall spacersdisposed along vertical sidewalls of the second doped epitaxy region andseparating the second epitaxy doped region from an interlevel dielectriclayer.
 5. The semiconductor structure according to claim 1, furthercomprising: a contact on the second doped epitaxy region.
 6. Thesemiconductor structure according to claim 1, wherein the first dopedepitaxy region has a dopant concentration of at least about 5×10²¹atoms/cm³, and the second doped epitaxy region has a dopantconcentration of at least about 4×10²⁰ atoms/cm³.
 7. A semiconductorstructure comprising: a bottom source drain region arranged on asubstrate; a semiconductor channel region extending vertically upwardsfrom a top surface of the bottom source drain region; a metal gatedisposed on and around the semiconductor channel region; a top sourcedrain region above the semiconductor channel region and comprising afirst epitaxy region and a second epitaxy region; and a dielectricspacer disposed on the metal gate beneath the second epitaxy region, thedielectric spacer contacts vertical sidewalls of the metal gate andvertical sidewalls of the first epitaxy region.
 8. The semiconductorstructure according to claim 7, wherein the dielectric spacer separatesthe metal gate from the top source drain region.
 9. The semiconductorstructure according to claim 7, wherein a first portion of thedielectric spacer comprises a first height, and a second portion of thedielectric spacer comprises a second height.
 10. The semiconductorstructure according to claim 7, further comprising: a bottom spacerseparating the bottom source drain region from the metal gate.
 11. Thesemiconductor structure according to claim 7, wherein a width of thefirst epitaxy region of the top source drain region is substantiallyequal to a width of the semiconductor channel region, and wherein awidth of the second epitaxy region of the top source drain region islarger than the width of the semiconductor channel region.
 12. Thesemiconductor structure according to claim 7, further comprising:sidewall spacers disposed along vertical sidewalls of the second epitaxyregion and separating the second epitaxy region from an interleveldielectric layer.
 13. The semiconductor structure according to claim 7,further comprising: a contact on the second epitaxy region.
 14. Thesemiconductor structure according to claim 7, wherein the first dopedepitaxy region has a dopant concentration of at least about 5×10²¹atoms/cm³, and the second doped epitaxy region has a dopantconcentration of at least about 4×10²⁰ atoms/cm³.
 15. A methodcomprising: forming a bottom source drain region on a substrate; forminga semiconductor channel region extending vertically upwards from a topsurface of the bottom source drain region; forming a metal gate disposedon and around the semiconductor channel region; and forming a top sourcedrain region above the semiconductor channel region, the top sourcedrain region comprises a first epitaxy region and a second epitaxyregion.
 16. The method according to claim 15, further comprising:forming a dielectric spacer disposed along vertical sidewalls of themetal gate and vertical sidewalls of the first epitaxy region beneaththe second epitaxy region.
 17. The method according to claim 15, furthercomprising: annealing the first epitaxy region before forming the metalgate, wherein annealing the first epitaxy causes dopants from the firstepitaxy region to diffuse into the channel by annealing
 18. The methodaccording to claim 15, further comprising: forming a bottom spacerseparating the bottom source drain region from the metal gate.
 19. Themethod according to claim 15, wherein a width of the first epitaxyregion of the top source drain region is substantially equal to a widthof the semiconductor channel region, and wherein a width of the secondepitaxy region of the top source drain region is larger than the widthof the semiconductor channel region.
 20. The method according to claim15, further comprising: forming sidewall spacers disposed along verticalsidewalls of the second epitaxy region and separating the second epitaxyregion from an interlevel dielectric layer.